Home - Semiconductor

Optimize Solutions,
Maximize Performance!

To become the leading solutions provider in the Semicon industry.

About us

Semicon has a team of highly experienced consultants who are always ready to support customers according to their specific needs.

About Semicon

Semicon Joint Stock Company was established on March 6, 2015. Semicon is a pioneer distributor in the chemical, electronics, safety and labor protection industry. We are always evaluated by domestic and foreign partners as: "Reputable supplier - Reliable partner" with quality service, professional service in the field of distributing quality products and advanced technology for the electronics, mechanical engineering, automobile and labor safety equipment industries in the national market. Sotaville is currently the official distributor of major brands such as: Bosch, Milwaukee, Dupont, Honeywell, Elvex, Ansell, NewPg, GVS ...

Featured event

SEMICON TECHNOLOGY JOINT STOCK COMPANY organizes and participates in various events within the semicon industry.

Process flow

01 Preserving

This is the process of temporarily protecting the wafer surface or structure to prevent damage, scratches, or contamination during subsequent handling.

02 Lamination

In this step, a special protective film is laminated onto the wafer surface. The film secures and protects the wafer, keeping it stable during the dicing process.

03 Stealth Dicing

This is a laser-based dicing method. Instead of cutting directly, the laser focuses inside the silicon to create internal cracks, and the wafer is then separated along these lines. It minimizes dust, reduces mechanical stress, and is ideal for thin wafers.

04 Back Grinding

This process thins the backside of the wafer, reducing its thickness from about 700 µm to just a few dozen µm. Thinner wafers allow chips to be smaller and lighter, meeting the requirements of modern compact electronic devices.

05 Die Attach SSD

In this stage, NAND Flash chips or controllers are attached to the substrate of a solid-state drive (SSD) using specialized adhesive or solder. This ensures mechanical stability as well as good thermal conductivity.

06 Die Attach RAM

Similar to SSD assembly, DRAM dies are attached to the RAM module substrate. This process requires high precision to prepare for wire bonding or flip-chip interconnection, ensuring both performance and reliability of the RAM.