TIA225GF is a two-component, soft, thermally conductive silicone material designed to vent heat away from electronic devices. Its uniform, non-slumping properties provide shape stability for optimized processing. XE14-TM009 can be used as a dispensable liquid alternative to pre-fabricated thermal pads, suitable for a wide range of heat dissipation designs in diverse electronic applications.

Key Features

• High thermal conductivity

• Fast cure at low temperatures

• Easy 1:1 mix ratio by weight

• Remains soft and flexible after cure to help reduce stress during thermal cycling

• Excellent non-slumping properties

• Reworkable after dispensing

• UL 94 V-0 flame-retardant certified

Applications

Thermal interface material for electronic devices in automotive, consumer electronics, communications, lighting, and industrial applications.