Home Solutions Semiconductor Packaging Materials

A Broad Portfolio of Materials for All Types of Advanced Semiconductor Packages

With more than 50 years invested in technology development, DuPont Electronics & Industrial understands the needs in the market and has developed a broad portfolio of semiconductor packaging materials for a range of technology areas.

We draw from other areas of the company to leverage expertise across the entire electronics manufacturing supply chain.

Through close relationships with leading-edge manufacturers, we develop new materials to meet ever changing requirements, from workhorse packages like flip-chip technologies to emerging technologies like fan-out wafer level packaging and through silicon vias (TSVs). We are technology leaders in electroplating materials used for underbump metallization (UBM), copper redistribution layer (RDL), Copper pillars, and solder bumps, along with polymers and dielectrics for RDL. Other advanced materials include photoresists and TSV fill.

Choose DuPont as your materials solutions partner to:

  • Get a complete solution, not just materials
  • Tap into years of expertise and technology from across Electronics & Industrial
  • Benefit from development that stays ahead of the industry trends

Product Families

  • Copper Pillar Plating
  • Copper Redistribution Layer
  • Solder Bump Plating
  • Under Bump Metallization
  • Bump Plating Photoresists
  • Through Silicon Via Copper
  • Packaging Dielectrics
What Are Semiconductor Packaging Materials?

Semiconductor packaging materials are a class of electronic solutions used to form the connection of the IC chip to the package substrate, another package or directly to the printed circuit board. These materials are critical to semiconductor wafer-level packaging processes, heterogeneous integration, and 3D integration technologies.

Today’s leading-edge electronics are expected to have more functionality packed in a smaller form factor, using less power, while improving performance and reliability. These devices power mobile devices, high performance computers, the IoT, memory, automotive electronics, the 5G networks of the future and more. They rely on semiconductor packaging materials that follow the Heterogeneous Integration Roadmap (HIR) and are designed to meet these stringent requirements.

Semiconductor Packaging Materials

Copper Redistribution Layer

Copper Redistribution Layer

DuPont Electronics & Imaging copper chemistries for redistribution layers (RDLs) are ideally suited to today’s high-density requirements for wafer level packaging applications.

Copper Redistribution Layer

DuPont Electronics & Imaging copper chemistries for redistribution layers (RDLs) are ideally suited to today’s high-density requirements for wafer level packaging applications.

Solder Bump Plating

DuPont’s award-winning Solderon™ BP electroplating chemistries are a reliable alternative to tin-lead alloys for all wafer bumping applications.

Solderon™ BP IN 1000 indium plating chemistry is designed for solder plating processes used in advanced wafer-level packaging for emerging applications that are sensitive to temperature. Its use minimizes substrate warpage and stress, and reduces the possibility of damaging materials in delicate devices due to significantly reduced reflow temperature.
SOLDERON BP PRIMARY / 1 GA COR PDB

Under Bump Metallization

We offer a production-proven electroplating nickel chemistry tailored to meet a variety of UBM process needs

Bump Plating Photoresists

DuPont offers positive- and negative-tone photoresists designed to meet the tight pitches and varied topographies of today’s semiconductor advanced packaging applications.

Wafer-level packaging dry-film photoresist solutions for 3DIC
DuPont offers liquid bump plating photoresists, along with associated ancillaries, that are ideally suited for wafer-level packaging applications using single-spin coating.

Through Silicon Via Copper

Years of experience and success in electroplating damascene copper have helped DuPont bring leading-edge copper TSV chemistries to the advanced packaging market.

Packaging Dielectrics

Look to DuPont for packaging dielectric formulations that have the mechanical properties, high resolution, low-temp curing, easy processes, and superior reliability needed to protect your advanced WLP.

View more product