Product Description
The high rate of compliancy of Tflex 300TG allows the material to totally blanket the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times. Tflex 300TG, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2 W/mK, low thermal resistance can be achieved at low pressures.
A Tgard silicone liner has been added to the Tflex 300TG to offer a guaranteed dielectric barrier. The Tgard is cut-through resistant and provides easier part-handling in mass production.
Tflex 300TG Silicone based Thermal Gap Filler
Industries
- Aerospace/Defense
- Automotive
- Consumer
- Industrial
- Telecom/Datacom
Applications
- Automotive ADAS
- Automotive Electronics
- Automotive Infotainment
- Automotive Powertrain/ECUs
- Drones/Satellites
- Gaming Systems
- Instrumentation
- Notebooks/Tablets/Portable Devices
- Routers
- Smart Home Devices
- Wireless infrastructure
Features and Benefits
- Extreme compliancy allows material to “totally blanket” component(s)
- Low compression set enables the pad to be reused many times
- Provides a dielectric barrier
