Compatible Liquid Metal Pad

Thông tin sản phẩm:
  • Low-melting-point alloy: Enables stable operation under extreme temperature conditions, ensuring optimal cooling performance.

  • High thermal conductivity alloy: Enhances heat transfer efficiency, keeping devices effectively cooled and preventing overheating.

  • Ultra-low thermal resistance: With a value of 0.04 °C·cm²/W, the thermal pad ensures rapid and uniform heat dissipation.

  • Convenient packaging: Smart, container-free design saves space and allows for easy handling and installation.

  • No sagging or flow: Provides high stability without affecting device operation.

  • Non-corrosive to metals: Safe for components made of aluminum, copper, and other metals.