Elevate® Cu 6388 is a sulfuric based two component acid copper plating process. It produces deposits that are fine grained, equiaxed and high purity from a two component system.
Elevate® Cu 6388 uses only a brightener and a carrier as it was not formulated to achieve a flat top. When the bath is run at optimum the feature profile will be convex. Slight changes in operating parameters may be able to slightly change the profile but a flat top feature can only be achieved with the use of a leveler.
Elevate® Cu 6388 is an all purpose copper plating bath this is used when the application does not require flat top pillars, RDL or via fill.
