Elevate® Cu D3000 is a versatile three component electrolytic copper plating process specifically formulated to plate various types of advanced packaging structures using the same organic system. It can successfully plate RDL patterns, copper pillars and most other types of features required for advanced packaging.
With small adjustments to the operating parameters a flat, convex or concave feature can be achieved.
All Elevate® Cu D3000 organic and inorganic components are fully analyzable with a Technic Elevate Analyzer.
