Elevate® Gold 7900 Deplate is primarily used to remove seed layer gold from gold electroplated wafers using reverse current. It has also been used for selective gold removal. After deplating the gold features retain their original uniform appearance.
Bath is free of cyanide, uses all liquid components and is formulated to provide an extended bath life. This formulation is an improvement of the legacy process – Cyless Electrolytic Gold Strip.
ASM-NEXX performed initial testing and validation of Elevate® Gold 7900 Deplate with positive results.
