Elevate® Ni 5950 is a boric acid nickel free solution that provides a safer, more fab friendly process without sacrificing performance.
It can improve WIW performance and deposits from this solution provide a more favorable grain structure and lower stress compared to a standard nickel sulfamate process.
Has been used successfully for pattern plating, metal stack plating and as a hard mask for SiC etching.
All components are liquid which eliminates the problematic replenishment of a boric acid salt to the working solution.
