The Optivision™ Max series is Qnity’s latest commercial soft pad for chemical mechanical planarization (CMP), engineered with high purity and tightly controlled manufacturing. This precision delivers outstanding defect control, extended pad life, and consistent removal rates—helping customers enable next-generation technologies such as high-bandwidth memory and advanced wafer bonding with reliable, high-performance CMP results.

Applications

Cu barrier, Cu Bulk, Buff (Oxide, Tungsten)

Features & benefits

Available with windows to enable endpointing options
Delivers the exceptional defect performance within Qnity’s soft pad portfolio
Offers longer pad life compared to Politex™ and Optivision™ pads, reducing tool downtime and lowering overall cost of ownership
Maintains stable removal rates and defect performance throughout pad life, ensuring consistent CMP results

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