The Optivision™ Max series is Qnity’s latest commercial soft pad for chemical mechanical planarization (CMP), engineered with high purity and tightly controlled manufacturing. This precision delivers outstanding defect control, extended pad life, and consistent removal rates—helping customers enable next-generation technologies such as high-bandwidth memory and advanced wafer bonding with reliable, high-performance CMP results.
Applications
- Cu barrier, Cu Bulk, Buff (Oxide, Tungsten)
Features & benefits
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