The Acuplane™ slurry platform includes copper barrier and through silicon via (TSV) slurries with a tunable range of film selectivity. Acuplane ™ slurries demonstrates predictable performance in logic and memory integration schemes and is available in production volumes for both mature and advanced device nodes.

Applications

Barrier metals – Acuplane™ slurries are designed to precisely remove barrier metals used on copper and cobalt metallization schemes.
Building on Qnity’s TSV, silicon and polymer polishing expertise, our advanced packaging slurry portfolio extends to enable chip-on-wafer-on-substrate (CoWoS) and silicon interposer integration schemes, as well as polymer polishing capability.
Qnity slurries are designed as platforms on which customers can request a range of selectivity options.
These slurries accommodate silicon, oxide and metal removal needs as defined by customers’ specific device integration needs.
Through silicon via (TSV) – Qnity has an industry-leading portfolio of Acuplane™ TSV slurry solutions for both front and backside polishing.

Features & benefits

Slurries are designed to enable the planarization and material removal such that surface quality and material property integrity is maintained or improved.
Slurries are made up of a combination of key additives which enable precise polishing of the wafer surface.
State-of-the-art polishing slurries enable topography or flatness to be maintained at or less than 300 angstroms across a 300mm wafer.
Surface finish of materials, including corrosion sensitive metals, is maintained at the single-digit angstrom level.

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