PCMPSolv™ 3200 series are high volume, post-CMP Tungsten interconnect cleans for the manufacturing of advanced semiconductor devices, both for BEOL and middle-end-of-line (MEOL) applications such as Co and TiN.
PCMP3205 offers a manufacturing-proven post-CMP cleans featuring a weakly acidic pH formulation for W CMP. This single chemistry solution is designed to be used in the buff platen or pre-clean module of CMP tools, is compatible with W, and provides very low defectivity on TEOS or Silicon Nitride films. PCMP3205 focuses on reducing organic defectivity before applying a PCMP brush process.
PCMP3210 offers a manufacturing-proven, low cost-of-ownership post-CMP cleans featuring an alkaline pH formulation for W CMP. This single chemistry solution is designed to be used in the brush modules of CMP tools and is compatible with both W and Co, and provides very low defectivity on TEOS or Silicon Nitride films. PCMP3210 also incorporates dissolution agents for TiO2 debris originating from TiN barriers. PMCP3210 has a long list of material compatibility, including, Cu, Co, W, Mo, Ta, Ti, TiN, TaN, SiOx, SiNx, SiC, and is referred as a universal PCMP clean solution. PCMP3210 offers flexibility in dilution to meet low cost-of-ownership targets for all equipment cleaning modules.
