With the rapid emergence of wireless electronic devices, industrial manufacturers are facing challenges from electromagnetic waves and signal interference originating from multiple sources operating at the same frequencies, resulting in electromagnetic interference (EMI).

Modern devices are often equipped with radio frequency components to enable wireless connectivity. However, these components simultaneously introduce issues related to signal disruption and internal EMI within the device. To address this, materials with excellent conductivity and EMI shielding capabilities are required to minimize their impact on surrounding components on the circuit board, while also extending the overall product lifespan.

As electronic devices such as smartwatches, smartphones, tablets, smart speakers, and virtual assistants continue to be designed to be smaller, slimmer, and lighter, the challenges of EMI shielding and selecting the most suitable materials are becoming increasingly critical.