HFC HCM 850 Phase Change Thermal Materials

Thông tin sản phẩm:
  • Ultra-low thermal resistance of only 0.045 °C·cm²/W, ensuring fast and efficient heat transfer and significantly reducing device operating temperatures.

  • Phase change temperature of 50 °C, suitable for a wide range of electronic devices, especially high-power modules.

  • High stability, with no material migration during operation, ensuring long-term thermal performance.

  • Low oil bleed and low pump-out characteristics, minimizing contamination risks and protecting electronic components.

  • Low assembly pressure, enabling easy installation and reliable use.