Merged Functionality
Laird Specialty TIM solutions merge thermal conductivity with EMI shielding or RF absorbing capabilities into a component to meet your demands for cutting-edge products. Today’s electronics are creating more heat, operating at higher frequencies, requiring tighter packaging, and relying on cleaner signals from their antennas to compete in an ever-evolving market landscape. Laird solutions are targeted directly to meet these challenges and needs with specialty designed hybrid thermal interface materials.
