The Acuplane™ slurry platform includes copper barrier and through silicon via (TSV) slurries with a tunable range of film selectivity. Acuplane ™ slurries demonstrates predictable performance in logic and memory integration schemes and is available in production volumes for both mature and advanced device nodes.
Applications
- Barrier metals – Acuplane™ slurries are designed to precisely remove barrier metals used on copper and cobalt metallization schemes.
- Building on Qnity’s TSV, silicon and polymer polishing expertise, our advanced packaging slurry portfolio extends to enable chip-on-wafer-on-substrate (CoWoS) and silicon interposer integration schemes, as well as polymer polishing capability.
- Qnity slurries are designed as platforms on which customers can request a range of selectivity options.
- These slurries accommodate silicon, oxide and metal removal needs as defined by customers’ specific device integration needs.
- Through silicon via (TSV) – Qnity has an industry-leading portfolio of Acuplane™ TSV slurry solutions for both front and backside polishing.
Features & benefits
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