PCMPSolv™ 5600 Series is a high volume, post-CMP copper interconnect cleans required in the manufacturing of advanced semiconductor devices. It features high pH formulations for Cu BEOL and can be used with various barrier slurries.
It offers the following capabilities:
- Excellent particle removal capability
- Advanced barrier metals and dielectric compatibility, including Co, and Ru
- Compatible with ULK dielectrics
- Improved Cu static etch and lower surface roughness
- Contains Copper Oxidation Barrier (COB) functionality
- Excellent capability to remove BTA and other organics
- TMAH free
- Enhanced cost-of-ownership with high dilution design
PCMP5615 is an advanced PCMP formulation in high volume manufacturing, low cost-of-ownership copper post-CMP cleans featuring an alkaline pH formulation for Cu BEOL. This single chemistry solution can be used with acidic or basic barrier slurries; provides very low defectivity on copper and low-k surfaces; offers enhanced compatibility with sensitive low-k and ULK films; compatible with Co, and Ru applications, prevents the formation of circular ring defects. PCMP 5615 offers flexibility in dilution to meet low cost-of-ownership targets for all equipment cleaning modules.
PCMP5675 is an advanced PCMP formulation in high volume manufacturing, low cost-of-ownership copper post-CMP cleans featuring an alkaline pH formulation for Cu BEOL. This single chemistry solution can be used with acidic or basic barrier slurries; provides very low defectivity on copper and low-k surfaces; offers enhanced compatibility with sensitive low-k and ULK films; compatible conventional Ta/TaN barriers, prevents the formation of circular ring defects. PCMP5675 also features a Cu undercut mechanism to improve defect lift-off from Cu surface. PCMP5675 offers flexibility in dilution to meet low cost-of-ownership targets for all equipment cleaning modules, especially for mature logic technology nodes or memory applications.
PCMP5650 is an advanced PCMP formulation in high volume manufacturing, low cost-of-ownership copper post-CMP cleans featuring an alkaline pH formulation for Cu BEOL. This single chemistry solution can be used with acidic or basic barrier slurries; provides very low defectivity on copper and low-k surfaces, offers enhanced compatibility with sensitive low-k and ULK films, prevents the formation of circular ring defects, and is compatible with Co and Ru applications, PCMPSolv™ 5650 was specially designed for technology below 14nm, where organic defects control and minimal Cu and Co corrosion are required. PCMPSolv™ 5650 is also a highly concentrated chemical to meet low cost-of-ownership targets for all equipment cleaning modules.
